Model 3700E is a gantry with overhead ways and a moving bond head that brings the bonding function to the work and leaves the material handling process flow under customer control. It uses the full 2700B Series software to locate and bond automatically fine wire connections arrayed over a large, stationary work piece. There is no limit to the size of the work as this machine is entirely above the bond plane. The area traversed for bonding is six by nine and one-eighth inches; and successive areas could be presented. Bonding of fine Gold wire is by the ball and wedge method, allowing connections in all directions, but requiring work piece heat.

This machine follows a programmed path to all the targets across the bond area; locating each target by Pattern Recognition and correcting for placement error. Programming of the work path makes use of the fully developed and richly featured software from West Bond’s Model 2700B running under Windows. Interface is by keypad, mouse, and large LCD color display.

Bonding mechanism is constructed of three axes, straight-line and orthogonal, all driven by stepper motors in micro-step mode under program control. The long "X" and "Y" axes are moved via lead screw, and the "Z", by a linear spiral cam. A fourth motor drives the television camera assembly in "Z" direction for focus; and a fifth, sets force for each bond by varying the initial compression of a force counterbalance spring. Wire is fed from a spin-off 2-inch spool mount down through the capillary tool. A negative EFO torch wand at the home elevation is solenoid-driven into position to form balls.

All movement ways are hardened and ground vees with crossed rollers. The lead screws are positioned outside the ways, so to be accessed for maintenance without disassembly. Fine accuracy is assured by closed-loop feedback to the motor controls from an optical encoder system with glass scales and laser sensors mounted within the X- and Y-Axes.

The bond head transducer and wire clamps depend from the "Z" axis slide by a four-bar linkage to keep the tool vertical and extendable to any position that tunes ultrasonically, and to reduce mass on the bond. In standard arrangement, a 0.750-in. capillary, dropped 0.656-in. below center, provides clearance of 0.406-in. above the work plane for work piece package walls.

Overhead wire clamps, air-opened and spring-closed, are standard throughout the D- and E-Series. They are actuated during the lift stroke to feed a wire length for balling. The negative EFO torch is driven at the home position to form the ball: Therefore, for ball bonding, it is this position that defines the bond stroke rather that the lower work position, and work elevation must be adjusted to control stroke length.

Bond Force is set to program values by a motor with spiral cam that adjusts the initial compression of the force spring. This force is opposed by a constant spring that serves to hold closed firing switch contacts until bond contact.

The Tool Head of this series is built around K~Sine Transducer, Model No. 27-EC, one half wave in length, operating at a nominal frequency of 63 kHz. Radiant tool heat with constant current control is included.

The mechanism of this series was designed to mount above a customer's work handling system, to be confined entirely above the work plane, and so not to require any base or work platform: Custom mounting brackets can be designed to join to customer’s mechanism. This configuration is designated by the appended "X", as Model 3700EX. For tabletop application, the standard model of this Series, Model 3700E, is without any work holder or temperature controller. The floor-standing configuration becomes Model 3700E-90 by the addition of Feature –90, Frame. In any configuration, the Industrial Computer CPU Chassis and West·Bond’s Power Supply Chassis are housed as separate components.

A motorized Wire De-spooler, Assy No 10065, for 2-inch spools, and which also includes side-view Television Camera Assy No 10010 with Polaris Model No. MB-1250 Camera, is mounted on the Y-Axis.

A utility to detect failure of ball formation is included, so to halt immediately to prevent damage to subsequent bond sites.

ESD protected Olympus Model SZ51-60 Microscope with 15X eyepieces and the new LED illuminator "Luxuray" are included. No other microscope has equivalent clearance to the bond head. This microscope is mounted on a folded linkage that allows it to be positioned to view most of the bond area.

The separate power supply enclosure holds motor and logic electrical power supplies, and also K~Sine Part No 6795, four Watts, dual channel ultrasonic power supply. Settings of power and time program values are sent via an eight-bit interface.

Protection against Electrostatic Discharge is implemented by finishing exposed tool assemblies and other moving parts by Electro less Nickel plating, which is conductive; and all exposed painted parts with a powder-coated paint that is dissipative.

• Model No. 3700E. This machine with tool assembly No. 9765 for Ball Bonding at ultrasonic frequency of 63 kHz. There are no optional Features.
• Model No. 3700E-90. This machine for 63 Khz, including Feature –90, Floor-Standing Frame.
• Model No. 3700EX. This machine for 63 Khz, but less Base, Adjustable Platform, and Work Holder.
• Model No. 3730E. This machine with tool assembly No. 9774 for Ball Bonding at ultrasonic frequency of 110 kHz. There are no optional Features.
• Model No. 3730E-90. This machine for 110 Khz, including Feature –90, Floor-Standing Frame.
• Model No. 3730EX. This machine for 110 Khz, but less Base, Adjustable Platform, and Work Holder.

Compressed air, regulated to 50 psig, is required. Connection is via 1/4-inch tubing.

Electrical service required is 50-60 Hz, single phase, either 115 VAC or 230 VAC; however, input must be configured at the factory for 230 VAC. A fuse and three-prong power cord connector are provided for 115 VAC: For 230 VAC, these must be changed to conform to local requirements.

Machine dimensions are shown on the drawings below.

Weight is 410 lb. uncrated, or 450 lb. crated.